Encapsulation Capability
1. Multi-chip 2D/3D package;
2.12 inch wafer chip package;
3.QFN/DFN flat package;
4. Automotive electronic device packaging;
5.POWER high power IGBT package;
6. High-speed, close spacing, small welding window wire bonding; gold wire, copper wire/copper alloy wire, alloy wire, aluminum wire bonding; hybrid wire bonding;
7. Narrow scribe (Min = 40um) chip package; Thin chip (Min = 80um);
8. Test of trigger device (SIDAC);
Contact Us
Guangdong Fenghua Semiconductor Technology Co., Ltd.
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Hotline: +86 13720604604
E-mail：hanziyang@fenghua-semi.com
Address: No.10, Nanxiang 2nd Road, Science City, Luogang District, Guangzhou
WeChat public account
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