Process flow
A
Patch
→
B
Cutting
→
C
Upper core
→
D
Weld wire
→
E
plastic package
→
F
thermal aging
→
G
Electroplating
→
H
Annealing
→
I
Ram forming
→
J
Test
→
K
Packaging
→
Process Flow
Contact Us
Guangdong Fenghua Semiconductor Technology Co., Ltd.
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Hotline: +86 13720604604
E-mail：hanziyang@fenghua-semi.com
Address: No.10, Nanxiang 2nd Road, Science City, Luogang District, Guangzhou
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