organizational structure
Guangdong Advanced Microelectronic Packaging and Testing Engineering Technology Research and Development Center
I. Overview of the Engineering Technology Research and Development Center
The Guangdong Advanced Microelectronic Packaging Technology R&D Center is the first research institute in Guangdong Province dedicated to integrated circuit packaging and testing technology. It focuses on the development and testing of IC packaging processes, reliability, and novel packaging forms. The center integrates functions such as packaging process development, packaging materials research, advanced packaging technologies, reliability testing, product testing, new product development, and talent training. It also serves as an internship and training base for graduate students from various universities. Providing “one-stop” high-tech R&D support and technical consulting for electronic packaging enterprises in the Pearl River Delta and beyond.
Contact Us
Guangdong Fenghua Semiconductor Technology Co., Ltd.
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Company Office Number：+86 020-82075328
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Hotline: +86 13720604604
E-mail：hanziyang@nationstar.com
Address: No.10, Nanxiang 2nd Road, Science City, Luogang District, Guangzhou
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