research outcomes
1.Patent Achievements
To date, Fenghua Xindian has been granted 21 patents spanning third-generation semiconductor packaging, opto-sensing, and related fields.
2.Research Projects
Led by its own R&D team and in collaboration with South China University of Technology, Guangdong University of Technology and other universities, the company has established intern training bases and innovation programs to promote deep integration of industry, academia and research. It has undertaken key R&D projects in Guangdong Province, and independently developed new fields based on third-generation semiconductor packaging and testing. It has overcome technical bottlenecks and mastered packaging technologies such as 12-inch ultra-thin wafer dicing, solder paste bonding, high thermal conductivity semi-sintered silver paste bonding, thick copper and thick aluminum wire bonding, and high humidity sensitivity and high heat dissipation plastic packaging. It has filled the technical gap in the field of wide-bandgap gallium oxide single crystal material packaging and testing, laid the foundation for the development of ultra-high voltage power devices, and overcome the bottlenecks of high-power semiconductor device packaging yield and localization. In high-power density module power supplies, thermal simulation technology has been applied to improve heat dissipation efficiency by 30%. The reliability of SOT-323 automotive-grade products has been upgraded, filling the gap in domestic automotive-grade chip packaging and testing capabilities. It has also pioneered emerging applications, being the first to mass-produce LED drivers based on third-generation semiconductors, and achieved import substitution for high-integration optoelectronic sensor packaging technology.
3.Research Honors
4.Quality and System Product Certifications
The company has obtained certifications for ISO 9001 Quality Management System, ISO 14001 Environmental Management System, IATF 16949 Automotive Quality Management System, and OHSAS 18000 Occupational Health and Safety Management Syst
Contact Us
Guangdong Fenghua Semiconductor Technology Co., Ltd.
-
Company Office Number：+86 020-82075328
-
Hotline: +86 13720604604
E-mail：hanziyang@nationstar.com
Address: No.10, Nanxiang 2nd Road, Science City, Luogang District, Guangzhou
WeChat public account
Copyright©2023 Guangdong Fenghua Semiconductor Technology Co., Ltd. |
| By：www.300.cn
| Business License | SEO
