Guangdong Fenghua Core Technology Co., Ltd. is a holding subsidiary of Foshan Guoxing Optoelectronics Co., Ltd. (stock code 002449), established in 2000. It is a national high-tech enterprise specializing in the research, development, production, and sales of semiconductor discrete devices and integrated circuits. The company is located in Guangzhou Science City, covering an area of 30000 square meters and a factory area of 45000 square meters. It has over 20 (developed) internationally advanced semiconductor packaging and testing automation production lines. With over 400 employees, we can produce over 20 packaging series, over 1000 varieties, over 6 billion discrete semiconductor devices, and over 700 million integrated circuits.
The company implements ISO9001, ISO14001, IATF16949, and ISO45001 management systems, and its products have passed SNOY GP environmental certification, meeting RoHS environmental certification, REACH environmental requirements, and customer halogen-free requirements. The company has invention patents and utility model patents in the field of integrated circuit packaging technology, such as electrostatic protection devices and their chips, core loading machines and their workpieces, tire pressure sensor packaging lead frames, tire pressure sensor pressure calibration methods and equipment, tire pressure sensor warning methods and systems. It is one of the first batch of 94 integrated circuit enterprises encouraged by the country to develop, and has the Guangdong Advanced Microelectronics Packaging and Testing Engineering Technology Research and Development Center, It is the most growing semiconductor packaging and testing enterprise in China, a specialized, refined, and innovative small and medium-sized enterprise in Guangdong Province, a demonstration enterprise of integrity in Guangdong Province, a "Famous Brand in Guangdong Province", a "Famous Trademark in Guangdong Province", and a "Top Ten Famous Brands Recognized for Chinese Transistor Quality".
The company adopts a business model that combines standardized and customized services, providing more than 20 types of packaged semiconductor devices and integrated circuit products, including TO, SOT, SOD, SOP, TSSOP, QFN, DFN, etc. At present, the main direction of development is towards high added value, new green and energy-saving high-power devices, and power management ICs; On the basis of consolidating the advantages of SOD-123, SOT-23, SOT-25, SOT-26, SOT-89, SOT-223, TO-220AB, SOP8, TSSOP8 series mid range packaging products, the packaging form focuses on developing towards high-end packaging such as QFN, DFN, QFP, LQFP, BGA, CSP, SiP, etc.
Our products and services cover the OEM market for home appliances, consumer electronics, computers and peripherals, network communication, automotive electronics, electronic lighting, and IC packaging testing.
We will continue to enhance our customers' market competitiveness through professional management and personalized services, and strive to become an excellent supplier of semiconductor devices and packaging testing services.