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- Categories:制程能力
- Time of issue:2019-09-19 00:00:00
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Description:1. Multi-chip 2D / 3D package;
2.12 inch wafer chip package;
3.QFN / DFN flat package;
4. Automotive electronic device packaging;
5.POWER high power IGBT package;
6. High-speed, close-pitch, small welding window wire bonding; gold wire, copper wire / copper alloy wire, alloy wire, aluminum wire bonding; mixed wire bonding
7. Narrow track (Min = 40um) chip package
Information
1. Multi-chip 2D / 3D package;
2.12 inch wafer chip package;
3.QFN / DFN flat package;
4. Automotive electronic device packaging;
5.POWER high power IGBT package;
6. High-speed, close-pitch, small welding window wire bonding; gold wire, copper wire / copper alloy wire, alloy wire, aluminum wire bonding; mixed wire bonding
7. Narrow track (Min = 40um) chip package
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Guangdong Fenghua Semiconductor Technology Co., Ltd.
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E-mail：ganhai@fenghua-semi.com
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