All categories
All categories
Technical capability
- Categories:制程能力
- Time of issue:2019-09-19 00:00:00
- Views:0
Description:1. Multi-chip 2D / 3D package;
2.12 inch wafer chip package;
3.QFN / DFN flat package;
4. Automotive electronic device packaging;
5.POWER high power IGBT package;
6. High-speed, close-pitch, small welding window wire bonding; gold wire, copper wire / copper alloy wire, alloy wire, aluminum wire bonding; mixed wire bonding
7. Narrow track (Min = 40um) chip package
Information
1. Multi-chip 2D / 3D package;
2.12 inch wafer chip package;
3.QFN / DFN flat package;
4. Automotive electronic device packaging;
5.POWER high power IGBT package;
6. High-speed, close-pitch, small welding window wire bonding; gold wire, copper wire / copper alloy wire, alloy wire, aluminum wire bonding; mixed wire bonding
7. Narrow track (Min = 40um) chip package
Scan the QR code to read on your phone
About Us
Product center
Quick navigation
Contact us
Guangdong Fenghua Semiconductor Technology Co., Ltd.
Hotline:020-82075328
E-mail:ganhai@fenghua-semi.com
Add:No. 10, Second Nanxiang Road,Science City,Huangpu District, Guangzhou
WeChat public account

All rights reserved:Guangdong Fenghua Semiconductor Technology Co., Ltd.