Failure Analysis and Reliability Test:
The company was awarded “Guangdong Advanced Microelectronic Packaging and Testing Engineering Technologies” in 2007.
The research and development center of Guangdong advanced microelectronic packaging and testing engineering technologies is a provincial level research and development institution of engineering technologies jointly approved and set up by the Science and Technology Department of Guangdong Province, the Development and Reform Commission of Guangdong, and Guangdong Economic and Trade Commission in 2007.
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Guangdong Fenghua Semiconductor Technology Co., Ltd.
Hotline:020-82075328
E-mail:ganhai@fenghua-semi.com
Add:No. 10, Second Nanxiang Road,Science City,Huangpu District, Guangzhou
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