Letter of Invitation for Bids for the Company's Equipment Procurement Project for Sealing and Testing Technology Transformation
Guangdong Fenghua Core Electric Technology Co., Ltd.(hereinafter referred to as the "Tenderee") is herebyEquipment procurement project for transformation of sealing and testing technology (high-speed testing machine)ConcentrateUnified bidding, biddingAfter the bid is signed by the winning bidder and the tenderer.SetPreparationProcurement framework contracts. If you are interested in participating, please.2023Year 8 Month 18 DayGive before 17:00To《Tender Receipt Letter》and tender documents.
Deadline for Bid: 2023 Year 8 Month 18 Day 17:00
Unit Name:Guangdong Fenghua Core Electric Technology Co., Ltd.
Contact: Shi Xueyun
Address: Nanxiang 2nd Road, Science City, Huangpu District, Guangzhou10No.
The specific bidding documents can be downloaded from Guangdong Caiyi Platform (https://www.gdycy.com)!
Guangdong Fenghua Core Electric Technology Co., Ltd.
20237 Month 28 Day
Tender Letter of Guangdong Fenghua Core Electric Technology Co., Ltd.
Semiconductor wafer production capacity is in short supply, coupled with the tight automotive chips, resulting in the back-end sealing capacity burst. Semiconductor production capacity is in short supply, capacity plug explosion situation from wafer foundry extended to the packaging and testing industry, the original tight supply of packaging materials is not enough, delivery time and price increase, affecting the packaging and testing capacity, IC designers must ensure the packaging and testing capacity through price increases or signing long contracts.