Tight wafer production capacity affects the operation of post-closure testing manufacturers with worries.
Semiconductor wafer production capacity is in short supply, coupled with the tight automotive chips, resulting in the back-end sealing capacity burst.
Semiconductor production capacity is in short supply, capacity plug explosion situation from wafer foundry extended to the packaging and testing industry, the original tight supply of packaging materials is not enough, delivery time and price increase, affecting the packaging and testing capacity, IC designers must ensure the packaging and testing capacity through price increases or signing long contracts.
Zhang Qiansheng, chairman of Riyueguang Investment Control, pointed out that the sealing and testing business recovered before the fourth quarter of last year. At present, the production capacity is full, especially the demand for wire packaging is strong. The capacity gap is expected to continue to burn for a whole year. In addition, the sales volume of system-in-package (SiP) and the performance of new projects are strong, reaching US $3.5 billion last year, an annual increase of 50%. It is estimated that the growth momentum of SiP this year.
Wu Tianyu, chief operator of Riyueguang Investment Control, said the overall price environment was friendly, but it was still necessary to observe the upward trend of prices of raw materials and key components.
Li Jingong, chairman of the wafer testing factory Jingyuan Electric, pointed out that the tight production capacity of the sealing and testing industry will not know the results until the fourth quarter. Xinquan Chairman Lu Zhiyuan said, this year the semiconductor market can still maintain the growth tone, but there may be COVID-19 epidemic under the influence of the broken chain concerns, as well as the industry chain capacity shortage of variables, this year the semiconductor industry has new opportunities and new challenges.
Li Cheng pointed out that the insufficient wafer supply affected the DRAM memory supply of the drawing chip. Chief Executive Xie Yongda said that the demand for wired packaging and bump wafers (Bumping) was strong, and Li Cheng had transferred hundreds of wired machines originally used in memory to support logic chip packaging, opening the full capacity. The shortage of ultra-abundant capacity for transfer investment continues, and the tight supply of capacity may continue until the end of this year.
Panel-driven IC demand continued to boom, local legal persons pointed out that including television, display and smart phones and other application panel demand continued to boom, panel-driven IC channel inventory is very low.
However, the U.S. foreign-funded legal person said that the tight supply of wafers and the limited supply of wafers may limit the growth rate of revenue and profit of the back-end sealing plant, and the legal person expects the average selling price (ASP) of panel-driven IC testing to be raised again.
Zheng Shijie, chairman of Nanmao, pointed out that with continuous attention to wafer supply, large and medium-sized panels have benefited from an increase in the number of orders placed by customers, and the growth rate of drive IC with roll-to-roll thin film chip-on-chip packaging (COF) has increased. New tests for small-sized panels are in place and put into production to maintain high-grade dynamic standards.
In the IC carrier board section, Zheng Kai'an, a senior analyst at the Institute of Industrial Intelligence (MIC) of the Information Policy Association, said that Taiwan's three major ABF carrier board suppliers, including Xinxing, Nandian and Jingshuo, continued to expand production, but the growth rate of production capacity could not meet the demand, and the ABF delivery period continued to lengthen, reaching 40 to 50 weeks.
In addition, the automotive market temperature drive car controller, power components, sensing components and memory and other related chip demand, downstream sealing industry orders rapid growth, but also make various types of sealing capacity more tight.
Tender Letter of Guangdong Fenghua Core Electric Technology Co., Ltd.
Semiconductor wafer production capacity is in short supply, coupled with the tight automotive chips, resulting in the back-end sealing capacity burst. Semiconductor production capacity is in short supply, capacity plug explosion situation from wafer foundry extended to the packaging and testing industry, the original tight supply of packaging materials is not enough, delivery time and price increase, affecting the packaging and testing capacity, IC designers must ensure the packaging and testing capacity through price increases or signing long contracts.