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Tight wafer production capacity affects the operation of post-closure testing manufacturers with worries.

Release time:2021-06-05

Semiconductor wafer production capacity is in short supply, coupled with the tight automotive chips, resulting in the back-end sealing capacity burst. Semiconductor production capacity is in short supply, capacity plug explosion situation from wafer foundry extended to the packaging and testing industry, the original tight supply of packaging materials is not enough, delivery time and price increase, affecting the packaging and testing capacity, IC designers must ensure the packaging and testing capacity through price increases or signing long contracts.

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